The strength of imaging test technology is its capability to inspect the 'Quality' of solder joints.

A low injection pressure does not stress a fragile solder joint.

Insufficient or excessive solder joints that are created during assembly operations.

The typical failure of a solder joint due to electromigration will occur at the cathode side.

Due to the current crowding effect, voids form first at the corner of the solder joint.

A cold soldering iron requires time to reach working temperature and must be kept hot between solder joints.

Regarding the chassis' internal construction, every solder joint and wire-bend had to be just right.

When new, there was a high frequency of failures due to cold solder joints.

A good solder joint will improve the connection and prevent most corrosion.

This may require descending to design errors, a cold solder joint, or operator error and the like.