The individual chips are cut apart and each chip is wired into a separate package.

Computer speeds are currently limited by the bottleneck of getting data on and off individual chips.

First, packing more and more data onto individual chips can drastically reduce the cost of computer components.

Once the etching is finished, the individual chips are cut from the wafer and packaged.

After the wafers have been etched, they are sliced into individual chips, known as "dies."

If they get a certain combination of chips, the value of their individual chips are increased.

A wafer is sliced out of silicon and diced into individual chips.

The new version of the computer now integrates on a single processor features that once required 32 individual chips.

The wafer is then sawed apart to cut out the individual chips.

Make extra individual chips to serve alone or with a dip.