The hardness of diamond and its ability to cleave strongly depend on the crystal orientation.

When cut into wafers, the surface is aligned in one of several relative directions known as crystal orientations.

Basically, this means that if you track the crystal orientation around the line defect, you get a rotation.

Owing to the anisotropic nature of this material, the hardness depends on the crystal orientation.

Like a grain boundary, a twin boundary has different crystal orientations on its two sides.

This allows for identification of the crystal orientation at the single volume of the sample from where the pattern was collected.

Thus the candidate orientation with the highest number of votes will be the most likely solution to the underlying crystal orientation present.

(both produced by the same crystal orientation but with light passing through different faces of the crystals.)

Since all possible crystal orientations are measured simultaneously, collection times can be quite short even for small and weakly scattering samples.

The unique crystal orientation of confined polymers imparts anisotropic properties.