thick film technology

Many chip resistors are made using thick film technology.

Thick film technology is often used as the interconnecting medium for hybrid integrated circuits.

One key advantage for the circuit designer is complete freedom in the choice of resistor value in thick film technology.

He led the development of the HTS thick film technology to the point where it is now being used commercially.

This Global Business Unit is a manufacturer in the field of thick film technology for the photovoltaics industry.

Ceramic substrates (thick film technology) can also be used in some applications (such as automotive) where reliability is of highest importance.

Other products available include Power Controllers up to 25A using Thick Film technology.

Compared to DCBs, thick film technology offers a higher degree of design freedom but may be less cost-efficient.

Thick film technology is used to produce electronic devices such as surface mount devices, hybrid integrated circuits and sensors.

Thick Film Technology is at the heart of the CONDOR's light weight and long life.

Made using Thick Film Technology - Lightweight (0.5kg) - small, extremely low power consumption - uses "AA" cell batteries.

An integrated circuit is defined as: Circuits meeting this definition can be constructed using many different technologies, including thin-film transistor, thick film technology, or hybrid integrated circuit.

Thick film technology: Heating elements for high-temperature furnaces are often made of exotic materials, including platinum, molybdenum disilicide, molybdenum (vacuum furnaces) and silicon carbide.

Photoimageable thick-film technology is a combination of conventional thick film technology with elements of thin film technology, and it provides a low cost solution to producing high quality microwave circuits.

SLT research produced ball chip assembly, wafer bumping, trimmed thick film resistors, printed discrete functions, chip capacitors and one of the first volume uses of hybrid thick film technology.

The products transferred from Advanced Micro Electronics included small signal silicon planar transistors for military and industrial applications, Leadless Inverted Devices (LIDs) and hybrid circuits using both thin and thick film technology.