thermal design power , TDP (Abkürzung)

The relationship between clock frequencies and thermal design power (TDP) are linear.

The thermal design power which is dissipated during operation has become as essential as computing speed of operation.

This is in response to the heat-versus-speed limit that is about to be reached using existing transistor technology (see: thermal design power).

See also Thermal Design Power.

Thermal design power:

AMD PowerTune aims to solve thermal design power and performance constraints.

Early Intel specifications mistakenly claimed a halving of the Thermal Design Power.

The processor has a Thermal Design Power of 130 W and will slow itself down if this power is exceeded.

The thermal design power and CPU power dissipation issues in supercomputing surpass those of traditional computer cooling technologies.

With the mobile version, the thermal design power can no longer be determined from a one- or two-letter suffix but is encoded into the CPU number.

Intel plans to reduce power consumption of its chips for Ultrabooks, like Ivy Bridge processors, which will feature 17W default thermal design power.

Most modern mainstream and value CPUs are made with a lower Thermal Design Power to reduce heat, noise, and power consumption.

The heat output of a CPU can vary according to its brand and model or, more precisely, its thermal design power (TDP).

Given the high thermal design power of high-speed computer CPUs and components, modern motherboards nearly always include heat sinks and mounting points for fans to dissipate excess heat.

Barebones may also have limit on the maximal processor thermal design power (TDP) and not be able to support CPUs that would otherwise fit into the socket.

The core has the ability to execute 512 threads simultaneously (Simultaneous multithreading, SMT), at a rated thermal design power (TDP) of 165 W.

The Intel Atom processor, N270 (Diamondville) features a thermal design power of just 2.5 watts at peak levels while supporting Intel SpeedStep(R) technology.

Power consumption is also expected to be on par with the previous-generation VIA CPUs, with thermal design power ranging from 5 W to 25 W.

In electronics industry, dark silicon is the amount circuitry of an integrated circuit that cannot be powered-on at the nominal operating voltage for a given thermal design power (TDP) constraint.

As of September 2009, all Clarksfield processors are marketed as Core i7, in three product lines differing in thermal design power and the amount of third-level cache that is enabled.

In the late 1990s, and in the high-performance microprocessor segment, heat generation (Thermal Design Power), due to switching losses, static current leakage, and other factors, emerged as a leading developmental constraint.

Thermoelectric cooling devices which actually refrigerate using the Peltier effect can help with high thermal design power (TDP) processors made by Intel and AMD in the early twenty-first century.

Datasheets normally contain the thermal design power (TDP), which is the maximum amount of heat generated by the CPU, which the cooling system in a computer is required to dissipate.

The Core 2 Solo, introduced in September 2007, is the successor to the Core Solo and is available only as an ultra-low-power mobile processor with 5.5 Watt thermal design power.

The Pentium M processors had a maximum thermal design power (TDP) of 5-27 W depending on the model, and were intended for use in laptops (thus the "M" suffix standing for mobile).