solderability

This is most likely to be related to the basic solderability of the board.

On some occasions when the shorts are at the top of the lead form it is a solderability issue.

The next challenge to solderability will come when ball grid array technology becomes widely used.

High grade materials have been used to ensure good solderability, ease of assembly and reliability in the field.

This also ensures the continuing solderability of the terminals.

Solderability varies depending on the type of solder alloy under discussion.

Uniformity, electrical conductivity and solderability are other important properties for this application.

Oleic acid is the classic flux material that has been used to improve solderability.

Both quantitative and qualitative tests for solderability exist.

The advantage is that the improved adhesion and solderability characteristics enable traditional assembly techniques.

The gold thickness needs to meet certain tolerances to ensure that the nickel maintains its solderability.

All circuit board assemblies are visually inspected for solderability and must comply with our quality assurance.

Good solderability requires wetting (low contact angle) of the substrate by the solder.

Magnetic properties, corrosion resistance and solderability are properties that have contributed the most to its success.

Sometimes the cladding is silver, chosen for its solderability, or nickel, which generally resists corrosion.

Carbon is another nickel contaminant that hinders solderability.

Tin is also widely used in the electronics industry because of its ability to protect the base metal from oxidation thus preserving its solderability.

The low melting point, solderability and malleability of the organ metal makes the construction of pipes relatively easy.

The solderability of a substrate is a measure of the ease with which a soldered joint can be made to that material.

Wetting Balance - Method of assessing solderability of metals.

However, many capacitor series are specified only for two years storage time, but the limit is set by oxidation of terminals and resulting solderability problems.

The Sn-Cu intermetallics then can get exposed to oxidation, resulting in impaired solderability.

Plated to BS 2011 for improved solderability.

Surface Conditioners - Liquid cleaners used to restore solderability of metals prior to soldering.

Another cause can be poor solderability of component terminations, either due to poor plating during the manufacturing process or poor storage.