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Eggs filled with glass etching solution, paint-balls and spray-paint were also used.
Etching is simply carried out by placing the slice or thin section face up in the chosen etching solution.
By then running an etching solution through the channel, part of the PDMS will be removed.
The spectrometric response of soda glass detectors to fission fragments of 252Cf has also been investigated using the new etching solution.
The industrial waste was sulphidized with iron sulphate or sulphide recovered from waste etching solutions.
During the attack windows were covered with eroding etching solution, and slogans were sprayed on the exterior with red paint.
Different substrates need different etching solutions, such as hydrochloric, hydrofluoric, and sulfuric acids (also called sulphuric acid).
Acid Etching: A suitable acid etching solution applied in accordance with the manufacturers' instructions will return the surface to new.
Fountain solution, the water and acid etching solution that prevents ink from sticking to non-image areas, is distributed through a chrome fountain roller.
More efficiently, the two spent etching solutions are combined under mild acidic conditions, one neutralizing the other, to produce higher yield of basic copper chloride (eq.
Once the final decision is made, the teeth are brushed with a pumice and then a mild etching solution is applied that roughens the surface to aid adhesion.
Precisely patterned electrical circuits and antennas have been deposited on plastic films using only an inkjet printer, a coating or etching solution, and a cleaning solution.
If an acid etching solution is used, be sure to remove all acid by rinsing the surface thoroughly with clean water, and allow it to dry thoroughly before painting.
The simplest method, used for small-scale production and often by hobbyists, is immersion etching, in which the board is submerged in etching solution such as ferric chloride.
Phosphoric acid is used in dentistry and orthodontics as an etching solution, to clean and roughen the surfaces of teeth where dental appliances or fillings will be placed.
The second approach requires a reduction in the surface tension of the chromium electroplating, chromium anodizing or reverse etching solution to a value that is less than 40 dynes/cm.
The etching solution at the center is flanked by non-etching solutions and the area contacting etching solutions is limited by the surrounding non-etching solutions.
Etching solution can consist of either hydrochloric acid diluted with six parts by volume of water, or phosphoric acid diluted with ten parts by volume of water.
It was found that the developed Bi/In has a lower etch rate than that of SiO2 in the etching solutions, making it a potential masking material for silicon bulk micromachining process.
This can be done by applying photoresist, exposing image to ultraviolet rays, and then etching using iron chloride, cupric chloride or an alkaline ammonia etching solution to remove the copperclad substrate.
After chemical etching, small pits are formed where the etching solution preferentially attacks the sample surface around the dislocations intercepting this surface, due to the more highly strained state of the material .
The nature and composition of the metal can normally be established by sectioning and polishing the bulk, and examining the flat section using optical microscopy after etching solutions have been used to provide contrast in the section between alloy constituents.
A hydrophobic surface is generated if the native oxide layer is removed by either plasma treatment or by fluoride containing etching solutions, e.g. hydrogen fluoride (HF) or ammonium fluoride (NHF).
Federico Faggin first task was to develop the precision etching solution for the amorphous silicon gate, and then he created the process architecture and the detailed processing steps to fabricate MOS ICs with silicon gate.
• Where companies do not release from a point source, the regulation requires these companies reduce the surface tension of the chromium electroplating, chromium anodizing or reverse etching solution and maintain the surface tension of the solution below 40 dynes/centimetre at all times during electroplating, anodizing or reverse etching.