low-angle grain boundary technical , LAGB (Abkürzung)

The edge dislocations will rearrange themselves into tilt boundaries, a simple example of a low-angle grain boundary.

Such deformation increases the concentration of dislocations which may subsequently form low-angle grain boundaries surrounding sub-grains.

However, films of all crystallographic phases contained a large density of planar defects such as twins, stacking faults, and low-angle grain boundaries.

This occurs through a gradual elimination of extraneous dislocations and the rearrangement of the remaining dislocations into low-angle grain boundaries.

The deformation is accompanied by the serration of the grain boundaries due to surface tension effects where they are in contact with low-angle grain boundaries belonging to sub-grains.

Plastic deformation of the graphite powder particles occur due to the shear bands decomposing into sub-grains that are separated by low-angle grain boundaries, further milling decreases the sub-grain size until nanosize sub-grains form.

At moderate to high temperatures, particularly in materials with a high stacking fault energy such as aluminium and nickel, recovery occurs readily and free dislocations will readily rearrange themselves into subgrains surrounded low-angle grain boundaries.